| 1. | Printed boards . mass lamination panels . general requirements
印刷电路板.质量叠片结构板.一般要求 |
| 2. | Mass lamination panel
预制内层覆箔板 |
| 3. | Printed wiring boards - specification for mass lamination panels semi - manufactured multilayer printed boards
印制电路板.第12部分:大批量叠片 |
| 4. | Printed boards ; part 12 : specification for mass lamination panels semi - manufactured multilayer printed boards
印制电路板.第12部分:大块分层面板 |
| 5. | The group also commenced offering multi - layer printed circuit board customers with value - added services including drilling and mass lamination to become a total solution provider in the market . the group is very keen to expand its laminate production capacity
此外，集团亦开始为印刷线路板客户提供钻孔及层压加工等增值服务，积极在覆铜面板市场上提供更全面的产品配套服务。 |
| 6. | The group also commenced offering multi - layer printed circuit board customers with value - added services including drilling and mass lamination to become a total solution provider in the market . the group is very keen to expand its laminate production capacity
此外，集团亦开始为印刷线路板客户提供钻孔及层压加工等增值服务，积极在覆铜面板市场上提供更全面的产品配套服务。 |
